PART |
Description |
Maker |
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SOT-89-3L |
PACKAGE OUTLINE DIMENSIONS
|
ETC
|
081029132611 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
TO-247ACPACKAGE |
Case Outline and Dimensions
|
International Rectifier
|
TO247 TO247AC TO247C |
HEXFET TO-247AC Outline Dimensions are shown in millimeters (inches)
|
Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
TO252 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT109-1 |
Package outline
|
NXP Semiconductors Philips Semiconductors
|